Intelligent Thermal Management Chip Provider Andigilog Completes Series B Financing

TEMPE, Ariz., Feb. 20, 2007 -- Andigilog®, the fabless semiconductor company
providing intelligent thermal management solutions, has received $18 million in a Series
B financing. Four new investors participated in the round, including Inlign Capital
Partners, Intel Capital, Newbury Ventures and Shepherd Ventures. Also participating
were previous investors Valley Ventures, Mission Ventures and Palisades Ventures.

The company will use the growth capital to accelerate the penetration of its
thermal management products into the $2 billion desktop, notebook and cooling fan
markets. The funding will also be directed at extending the company’s broad product
portfolio into additional consumer and industrial markets.

Andigilog’s ThermalEdge™ technology enables highly accurate temperature
sensing, precision system control and cooling management. Systems using Andigilog’s
solutions operate faster, consume less power, run more quietly and have a longer life.

“Detecting and managing the heat generated by electronic devices remains one
of the industry’s most challenging tasks, and Andigilog’s Intelligent Thermal
Management platforms offer the leading solution for system manufacturers,” noted Bill
Sheppard, Andigilog president and chief executive officer. “The market recognizes our
position as thought leader in this space as evidenced by the numerous reference
designs we have captured in the PC space. We are excited to have these new Investors
join us and to leverage their broad industry experience as we continue to grow our
presence in the thermal management space.”